Power chips are attached to outside circuits via packaging, and their performance relies on the assistance of the product packaging. In high-power situations, power chips are generally packaged as power components. Chip interconnection refers to the electric link on the top surface of the chip, which is generally aluminum bonding cord in typical components. ^
Traditional power module plan cross-section
At present, business silicon carbide power components still primarily make use of the packaging innovation of this wire-bonded conventional silicon IGBT module. They face troubles such as large high-frequency parasitic specifications, inadequate warmth dissipation capacity, low-temperature resistance, and inadequate insulation strength, which limit using silicon carbide semiconductors. The display of exceptional performance. In order to address these issues and completely make use of the significant potential advantages of silicon carbide chips, lots of brand-new packaging innovations and options for silicon carbide power components have arised in the last few years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually developed from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold cords to copper cables, and the driving force is price reduction; high-power tools have created from aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product efficiency. The greater the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging techniques, Cu Clip technology has the following advantages:
1. The link between the chip and the pins is made of copper sheets, which, to a particular degree, replaces the conventional wire bonding approach in between the chip and the pins. As a result, an one-of-a-kind bundle resistance value, greater existing circulation, and much better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully save the price of silver plating and inadequate silver plating.
3. The product appearance is totally consistent with regular products and is generally made use of in web servers, mobile computers, batteries/drives, graphics cards, motors, power materials, and other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding approach
Both eviction pad and the Source pad are clip-based. This bonding approach is more costly and intricate, but it can achieve far better Rdson and far better thermal effects.
( copper strip)
Copper sheet plus cable bonding approach
The resource pad makes use of a Clip method, and eviction utilizes a Cord approach. This bonding technique is slightly more affordable than the all-copper bonding approach, conserving wafer area (applicable to very tiny gate locations). The procedure is easier than the all-copper bonding technique and can obtain much better Rdson and better thermal result.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding beryllium copper, please feel free to contact us and send an inquiry.
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